The registered capital of the third phase of China National Integrated Circuit Industry Investment Fund (Big Fund) is 344 billion yuan, with a focus on supporting the localization of mature processes

At COMPUTEX 2024, Huang Renxun announced the next generation AI GPU platform Rubin, which adopts TSMC 3nm CoWoS package and supports HBM4 memory, with AI computing power increased by 40% compared to Blackwell.

TSMC announced significant progress in its 2nm process (N2) research and development, with plans to mass produce by 2025, achieving a performance improvement of 10% -15% compared to 3nm,