Key information: At COMPUTEX 2024, Huang Renxun announced the next generation AI GPU platform Rubin, which adopts TSMC 3nm CoWoS packaging, supports HBM4 memory, and has a 40% increase in AI computing power compared to Blackwell.
Industry impact: This move intensifies the AI chip race, forcing AMD (MI400 series) and Intel (Falcon Shores) to accelerate iterations.